ASUS ROG RAMPAGE VI EXTREME ENCORE Gaming Desktop Motherboard - Intel X299 - LGA 2066
Intel X299 E-ATX motherboard LGA 2066 for Intel Core X-series processors, with 16 power stages, onboard Wi-Fi 6 (802.11ax), 10 Gbps Ethernet, USB 3.2 Gen 2x2, dual USB 3.2 Gen 2 front panel connectors, SATA, quad M.2 and Aura Sync RGB lighting
- Ready for the latest Intel® Core™ X-series processors to maximize connectivity and speed with up to four M.2 drives, USB 3.2 Gen 2x2, Intel® VROC and Intel® Optane™ memory compatibility
- Robust power delivery: Optimized power solution with 16 Infineon TDA21472 power stages, ProCool II power connectors, MicroFine Alloy chokes and 10K capacitors
- AI Overclocking: Quickly optimizes your CPU performance based on the CPU and cooler, achieving results that are extremely close to manual tuning by experts
- Comprehensive thermal design: Active cooling VRM heatsink, PCIe-zone M.2 aluminum heatsink, backplate, fan extension card II and water-cooling zone
- High-performance networking: Onboard Aquantia® 10 Gbps Ethernet, Wi-Fi 6 (802.11ax) with MU-MIMO support, and GameFirst V technology
- Unmatched personalization: Color OLED and ASUS-exclusive Aura Sync RGB lighting, including two additional RGB headers and two Gen 2 RGB addressable headers
- Industry-leading ROG audio: SupremeFX S1220 and ESS® SABRE9018Q2C for enthusiast-grade audio performance driven by Japanese capacitors
- DIY-friendly design: Pre-mounted I/O shield, ASUS SafeSlot, BIOS FlashBackâ„¢ and FlexKey
PERFORMANCE
The ROG Rampage - reimagined. ASUS ROG Rampage VI Extreme Encore EATX motherboard delivers extreme, dominating performance
Power Solution
Teamed Power Architecture
Modern CPU architectures up the ante for motherboard power design by transitioning from deep power saving modes to full load almost instantaneously. Our latest VRM architecture rises to the challenge by utilizing teamed power stages to rapidly swing current, while maintaining exemplary thermal performance.
A brief history
We became the first manufacturer to implement phase doublers when we shipped the A8N32-SLI Deluxe back in 2005. The board's VRM was lauded for elegantly overcoming the power handling capabilities of components that were available at the time and also reducing voltage ripple. Those benefits lead to phase doublers becoming universally accepted in the industry, and they are still used for similar purposes today.
A shift in CPU demands
However, the current crop of CPUs pack more cores than their predecessors, and the latest instruction sets allow them to crunch computationally dense workloads at an incredible pace. As an added bonus, they also consume less power at idle and can transition between loads states much more quickly. These improvements necessitate a re-evaluation of power design priorities because phase doublers add a propagation delay that hampers transient response
Bucking the trend
Fortunately, the latest Integrated power components can handle higher currents than the devices of yesteryear, making it possible to implement a simple circuit topology that isn't hamstrung by the processing lag of phase doublers. That's why our X299 motherboards utilize teamed power stages to deliver higher burst current per phase, while maintaining the thermal performance of phase-doubled designs.