MPN: BXSTS100C
Intel BXSTS100C STS100C Thermal Solution
Highlights
Specifications
General Information
Manufacturer
Intel Corporation
Manufacturer Part Number
BXSTS100C
Manufacturer Website Address
http://www.intel.com
Brand Name
Intel
Product Name
Passive/Active Combination Heat-Sink with Removable Fan
Packaged Quantity
1
Product Type
Cooling Fan/Heatsink
Fan Information
Number of Fans
1
Heatsink Information
Compatible Intel Socket
B LGA-1366
Physical Characteristics
Heatsink Material
Copper
Material Details
Miscellaneous
Additional Information
Maximum CPU TDP: 130W
With fan Installed:
- Pedestal chassis that provides adequate ventilation and correct temperature air to heat sink
With fan removed:
- Pedestal chassis with ducted airflow to heat sink
- 2U or larger rack chassis with ducted airflow to heat sink
Compatibility
- Intel Xeon processors
- Intel LGA1366 socket
Application/Usage
Processor